Film surface inspection device
It is a compound wafer appearance inspection device for SiC, sapphire, and GaN wafers.
It is effective for inspecting internal micro-pipes, delamination, surface scratches, foreign substances, polishing marks, and more. The inspection system features four optical systems: super macro, differential interference, dark field, and transmission, all equipped with autofocus, allowing inspections to be conducted in the same coordinate system using an automatic stage. Optionally, AFM and wafer thickness measurements can also be added to the same coordinate system. 【Device Applications】 ■ Internal micro-pipes in wafers ■ Internal delamination in wafers ■ Surface scratch inspection, polishing mark inspection ■ Foreign substance inspection (including internal) ■ Measurement of surface roughness and pattern inclination (optional AFM) ■ Inspection of scratches, pits, and bubbles ■ Non-contact thickness measurement (optional thickness gauge) ■ Micro-cracks, pinholes ■ General appearance inspection and more.
- Company：ブルーオーシャンテクノロジー
- Price：Other
